Encapsulating PU Materials

The sealing material has a great influence on the function of the LED chip. Poor heat dissipation or low light output rate will lead to the failure of the chip function. Therefore, the sealing material must have good thermal conductivity, high light transmittance, good heat resistance and UV (ultraviolet light) features such as strong shielding.

The encapsulating PU materials of Caselec^® series with the properties of satisfied strength, high elastic, excellent hydrolysis resistance, heat resistance, mycotic resistance, acid-base resistance, cold and heat shock resistance, ultraviolet radiation resistance, environmental friendly, electrical insulation and flame retardant, perform excellent when bonded with metals such as steel, aluminum, copper and tin, rubbers, plastics, wood and other materials, and are the ideal sealing materials.